**Job Description**
Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Process Integration, and Device engineering experience in Foundry to service local and global customers.
This job requisition is to seek an experienced Integration and Device engineer to join OTF to build a strong Yield engineering team including Integration and Device for Intel 18A technology to service global foundry customers. Candidates must possess strong Process integration knowledge which involves designing, developing, and optimizing the sequence of steps required for semiconductor devices, will work with various process technologies like lithography, etching, deposition, and chemical mechanical polishing. Experience and expertise in process integration, device engineering, and customer engineering are preferred.
As a Senior Process Integration Engineer, you may be responsible for but not limited to:
+ Providing technical support to customers for semiconductor products and processes, including design, yield, and performance issues, and drive solutions through collaboration with various Intel teams.
+ Troubleshooting issues related to semiconductor fabrication, including yield problems, process integration, and device performance.
+ Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis team members to identify the root cause of yield/performance issues and implement a mitigation plan in the defined timeline to meet committed production yield/performance targets and to support fast-paced yield ramp-up in high-volume manufacturing phases.
+ Owning NPI (New Product Introduction) in production fabs and perform product-specific process optimizations.
+ Work with cross-functional teams for engineering projects to improve product yield, quality, device performance, productivity improvement, and to reduce wafer cost.
+ Providing Engineering support for technical interactions with internal and external customers.
+ Project management by managing timelines and deliverables for multiple projects, providing regular updates and progress report.
+ Excellent communication skills, both verbal and written, with the ability to convey complex technical concepts effectively.
**Qualifications**
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
**Minimum Qualifications:**
+ Bachelor's Degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM relate Major.
+ 5+ years of applied industrial experience in Semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading-edge technology nodes.
+ Experience of foundry NPI activities and trouble-shooting tape-out issues with exceptional communication skills to communicate complex concepts, solutions, and strategic initiatives.
+ Experience with IC wafer fabrication process engineering, manufacturing systems, semiconductor materials, and wafer test (e.g., fabrication areas may include photolithography and advanced patterning, thin film deposition, planarization, defect metrology, or spectroscopy).
+ Experience interpreting product data including inline, e-test, and SORT data, finding failure root cause and inline indicators, and driving for solutions.
**Preferred Qualifications:**
+ Post graduate degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM relate Major.
+ 5+ years of applied industrial experience in Semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading-edge technology nodes.
+ Work in 3nm-16nm FinFET and sub 3nm GAA
+ Experience in Yield Improvement and High-Volume Manufacturing
+ Experience with Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization.
+ Experience with eight disciplines (8D) model, process control standards, FDC and SPC response strategy. Leading teams through end-to-end process and working knowledge and application of internal and external industry-standard audits and fully own compliance closure activities.
+ Ability to work across organizational boundaries using a structured problem-solving methodology to resolve process-related problems, quality improvement/tool improvement/ cost improvement actions.
+ Demonstrated experience managing the balance between foundry and customer needs. Direct experience working with external customers. Familiarity with industry standards and certifications.
+ Requirements listed would be obtained through a combination of industry-relevant job experience, internship experiences, and or schoolwork/classes/research. The specific duties and requirements for a Foundry engineer can vary depending on the complexity of the customers' projects. However, the role is crucial in ensuring customer satisfaction and the successful delivery of customer products.
\#Foundry, #Integration, #Device
**Inside this Business Group**
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
**Posting Statement**
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
**Benefits**
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)
Annual Salary Range for jobs which could be performed in the US $136,990.00-$193,390.00
*Salary range dependent on a number of factors including location and experience
**Working Model**
This role will require an on-site presence. *** Job posting details (such as work model, location or time type) are subject to change.**
